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Biz Opps: DoD SBIR 22.4 Annual BAA Topic Open DARPA HR0011SB20224-04, HR0011SB20224-05, HR0011SB20224-06 Wednesday, May 11, 2022 The Department of Defense announces the opening of the following Broad Agency Announcement (BAA) topics: DARPA HR0011SB20224-04: Innovative Fabrication Techniques for Millimeter-wave Linear Beam Vacuum Electron Devices HR0011SB20224-05: Readout Integrated Circuit Development for 2-micron Cutoff Linear Mode Staircase Avalanche Photodiodes HR0011SB20224-06: Hardening Aircraft Systems through Hardware (HASH) Full topic descriptions and instructions are available on DSIP at and at IMPORTANT DATES: May 11, 2022 : Topics open, begin submitting proposals in DSIP June 7, 2022 : Topic Q&A closes to new questions at 12:00 p.m

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