BGA Stencil MSM8992 CPU Reball Tin Template for LG LG G2 G3 G4 H790 V10 H968 VS986 LS990 current ct Product Size: 215mm x 63mm

Product Size: 215mm x 63mm x 36mm

Auto Ranging: Yes

UT387A is designed for drywall

Wire Connector  JST PH male connector

BGA Stencil MSM8992 CPU Reball Tin Template for LG LG G2 G3 G4 H790 V10 H968 VS986 LS990 current ct Product Size: 215mm x 63mmBGA rework stencil kits, a quality solder paste stencil solution. A ball grid array is a type of surface mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. Features: deformation resistant material Location of precise pins Note: Make sure you know how to install and replace this item, it is not an easy job for someone who does not have technical skills with disassembly or assembly